Leading Solder Preforms for Selectively Increasing Solder Volume

  • Repeatable solder volume precision
  • Minimize Flux residue
  • Low voiding
  • Thermal management
  • Highly customizable configuration
ALPHA Exactalloy Tape & Reel Preforms Offering increased solder volume for joint reliability, reduced flux residue for improved electrical reliability, and void reduction under component thermal pads.
  • Selective solder volume increase for solder joint strengthening
  • Enables 100% hole fill  
  • Eliminates rework and inspection after reflow
ALPHA AccuFlux BTC-578 Solder Preforms Technology designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak. 
  • Efficient heat dissipation through consistently low voids
  • Enhanced process stability and predictable reliability through repeatable void distribution
  • Maximizes mechanical integrity through increased solder volume


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