Leading Adhesives, Underfills and Edgebonds

  • Excellent adhesion to FR4
  • Fast flow /penetration underfills
  • Fast curing
  • Reworkable 
  • Produces strong, high reliability connections
ALPHA HiTech CF31-4010 High filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
  • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
  • High Tg and low CTE values drastically improve ability to pass more Stringent Thermal Cycling Test  
  • Reworkable
ALPHA HiTech CU31-2030 A capillary underfill designed for the protection of assembled chip packages on printed circuit boards.
  • Low Viscosity
  • Room temperature flow capability
  • High Glass Transition Temperature (Tg)
ALPHA HiTech CU21-3240 Designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.
  • Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
  • High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
  • Excellent Thermal Cycling Test performance


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