ALPHA® CVP-390V Solder Paste
Lead-free, no-clean solder paste, that maximizes process flexibility, ensuring electrochemical reliability in tough applications.
Contact UsProduct Overview
ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its compatibility with Innolot and ability to maintain high electrochemical performance on dense assembly designs makes this solder paste ideal for next-generation high-reliability applications.
Formulated for compatibility with finer powder types, ALPHA CVP-390V provides >2.00 CpK for transfer efficiencies between 60%-120% at area ratios as low as 0.60, under variable print process conditions, offering ultimate flexibility in manufacturing. Additionally, ALPHA CVP-390V maintains repeatable transfer efficiency on fine-feature 01005 components and excellent coalescence down to 170µm circle and square apertures.
Product Features
Exceptional Pin Testability to Ensure First Pass Yields
Superior Electrochemical Performance on Fine Pitched Components
Excellent Coalescence Down to 170 µm Apertures on High Density Assemblies
Compatible with SAC305 & Innolot High Reliability Alloys
Superior Electrochemical Reliability on Harsh SIR Profiles
ALPHA CVP-390V solder paste is engineered for exceptional electrochemical performance in the most stringent applications. This solder paste maintains Log SIR >8 in harsh condensing environments, such as automotive damp heat profiles, on covered components in advanced SIR profiles, and meets IPC-J-STD-004B requirements down to 0.100mm spacing. These results, combined with the Innolot alloy, make ALPHA solder pastes among the highest-reliability options on the market.
Excellent Transfer Efficiency and Manufacturing Flexibility
ALPHA CVP-390V solder paste offers unparalleled flexibility across all manufacturing environments, enhancing first-pass yield and throughput. Contour plots, generated as part of an advanced statistical DOE, were used to define the print characterization window when subjected to a wide range of Print Speeds (PS), Print Pressure (PP), and Stencil Releases (SR). ALPHA CVP-390V maintains >1.33 Cpk at area ratios above 0.52, and >2.00 Cpk at area ratios above 0.60 for transfer efficiencies between 60%–120%.
High Throughput and Yield
Our technologically advanced solder pastes are developed to provide high throughput, increased yield, and the lowest cost of ownership across a wide range of applications, including fine feature printing, low-temperature processing, low voiding, and more.
