View Solutions in Enabling Electronics Miniaturization
Fine Feature Enabling Solder Pastes
Our portfolio of solder pastes are designed to enable the assembly of high density board designs that include fine feature, tightly spaced components. The range of fine feature solder pastes includes options for printing, dispensing, pin transfer and jetting applications.
Fine Feature Enabling Cored Wire
We provide small diameter cored wire options for attaching and / or reworking miniaturized components.
Fine Feature Enabling Adhesives
We offer a uniquely designed underfill containing smaller particles and optimized fluidity for low standoff, fine pitch penetration