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  • ALPHA® HiTech CF31-4010 Edgebond

    ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond designed to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.

    • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
    • High Tg and low CTE values drastically improve ability to pass more Stringent Thermal Cycling Test  
    • Reworkable
    • Halogen-free and complies with RoHS Directive 2015/863/EU
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  • ALPHA® HiTech CF12-4485B Edgebond

    A one component, heat curable material to be dispensed on the corners of the BGA.  The cured edgebond will help to strengthen the soldered assembled components.

    • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
    • Long Pot Life of 7 days
    • Excellent Adhesion on FR4
    • Halogen-free and complies with RoHS Directive 2015/863/EU
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