Product Overview

The low temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C.  The flux residue from ALPHA JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation.

ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004.  All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

 

 

Product Features

  • Low temperature reflow profiles enables the use of low Tg PCB
  • Excellent deposit consistency with high process capability index across all board designs
  • Reduction in random solderballing levels
  • Excellent pin-test yield for single and double reflow
  • Available in Type 5 powder
Technical Bulletins
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Documentation icon - Technical Bulletin

ALPHA JP-501 Solder Paste Technical Bulletin English

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Documentation icon - Technical Bulletin

ALPHA JP-501 锡膏 技术公告 简体中文

Excellent deposit consistency

ALPHA JP-501 is able to deposit consistently down to 125um deposit size which can be used for tight design spacing as well as volume adder in complex PCB assemblies.

ALPHA JP-501 is a qualified on leading jet manufacturing equipment. 

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ALPHA JP-501 Flow Graphic
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