ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in circuit pin test yields and high electrochemical reliability. ALPHA JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes.
- Deposit capability and processability of circular dimensions down to 0.25mm (0.010”)
- Excellent deposit consistency with high process capability index across all board designs
- Reduction in random solderballing levels, increasing first time yield
- Excellent pin-testability
- Available in Type 5 and Type 6 powder
Excellent deposit consistency
ALPHA JP-500 is able to maintain excellent individual dot deposit consistency with accuracy of 80µm and deposit accuracy of 40µm on a 0603 footprint.