From advanced chip fabrication through to increased reliability of the printed circuit board, our semiconductor and assembly division is integrated across the whole manufacturing process.
Our advanced interconnect metallization and assembly materials are used in leading-edge chip fabrication. Our sintering technology and high reliability solder alloys improve reliability in power and consumer electronics applications.
Solder, solder pastes and fluxes that provide superior electrochemical performance, ensuring long term board-level reliability. These can be combined with our polymer materials to further improve thermal cycling and drop shock performance.
Wafer Level Packaging
Leading-edge technology and expertise to optimize high first pass yields, thermal management, electrical performance, enable design complexity, and deliver the lowest total cost of ownership for the wafer level packaging industry.