ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
It is a high glass transition temperature [Tg] and low coefficient thermal expansion [CTE] underfill. These features result in a high reliability solution.
- Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
- High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
- Excellent Thermal Cycling Test performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
Underfill For Exceptional Thermal Fatigue Resistance
Stand alone SAC solder joints in BGA and CSP assemblies tend to falter in thermally harsh automotive applications. High Tg and low CTE underfill [UF] is a reinforcement solution. As rework is not a requirement, this allows higher filler content in the formulation to develop such attributes.
ALPHA HiTech CU21-3240, has a high Tg of 165°C and low CTE1/CTE2 of 31 ppm/105 ppm, on assembled CVBGA360 and has been tested to pass 5000 cycles -40 +125°C thermal cycling test. For a better flow rate, preheat the substrates during dispensing.