News & Events

MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023. MacDermid Alpha’s experts and product portfolio will be on display in hall W2, booth 2F08. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).

MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, will showcase its integrated solutions of high-reliability solder pastes, alloys, reinforcement, and protective polymers engineered to deliver best-in-class board level reliability. The FIEE Brazil Electronics Trade Show is taking place July 18-21, 2023, in São Paulo, Brazil. The MacDermid Alpha team looks forward to meeting show visitors at booth L61.

MacDermid Alpha, a leader in integrated technologies and materials for the electronics industry, is pleased to announce its Channel Partnership Agreement with Amza Ltd. This strategic alliance commences with immediate effect and marks a significant milestone for both companies as they join forces to expand the distribution and sales of the Alpha® branded range of solder pastes, preforms, cored wires, and flux products across Israel, Gaza, and the West Bank area.

MacDermid Alpha Electronics Solutions celebrated the highly anticipated grand opening of its China Electronics Applications Center (CEAC) on June 2, 2023, in Pudong New Area, Shanghai. The center’s state-of-the-art capabilities encompass a wide range of services, including the rapid development of prototypes, precise reliability testing, and the exploration of ground-breaking application techniques.

Element Solutions Inc (NYSE:ESI) ("Element Solutions" or the “Company”), a global and diversified specialty chemicals company, announced two transactions to enhance its capabilities and deepen customer relationships in advanced electronics materials markets. Together, these transactions represent approximately $15 million of annualized adjusted EBITDA with significant growth potential as electronics markets improve and certain new technologies win customer qualifications.

MacDermid Alpha, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in hall 7, booth 460.

(Waterbury, CT USA) – April 5, 2023 – MacDermid Alpha, will be participating at Productronica China, April 13-15, 2023, at the Shanghai New International Exhibition Center (SNIEC) Shanghai. Visitors are welcome to booth 4528, Hall 4 to speak to our team of experts.

(Waterbury, CT USA) – April 6, 2023 – MacDermid Alpha, has expanded the Argomax® technology offering. Argomax® 2141 is a new silver sintering product, designed for electric vehicle power inverters. The sintered joint enables the fabrication of smaller, lighter, and reliable power train systems.

MacDermid Alpha, will present its latest research on high-speed copper plating at the 19th Annual Device Packaging Conference (DPC 2023), held March 13-16, at the We-Ko-Pa Conference Center in Fountain Hills, Arizona. Engage the industry experts at booth 31-32, where MacDermid Alpha will showcase the performance benefits of advanced materials for die attach, chip fabrication, and wafer-level packaging.

MacDermid Alpha, will showcase automotive, 5G infrastructure, mobile devices, film, and surface finishing technologies at the Source India show; Chennai Trade Centre, February 13-14. Powering a path to the future of chemicals utilized in electronic applications, MacDermid Alpha will exhibit at booth A17-A20 in Hall 1, reflecting their strong local presence in India and ongoing support to resident OEMs, EMS providers, ODMs, CEMs, and distributors.

As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next-generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha, will be highlighting their latest research on final finishes, lightweight bio-based polymers, solder alloy reliability for automotive applications, and brand new findings from test data on conformal coatings. The four separate technical presentations will take place at this year’s IPC APEX EXPO, January 24 – 26, at the San Diego Convention Center in California.