Bondline Control

Solder joint reliability is a function of alloy, bondline thickness, operating temperature excursions, and vibration. Bondline thickness can play a critical role, impacting assembly yield, and ultimately define the solder joint reliability. By controlling the bondline thickness, the solder thermal impedance is controlled, and the reliability of the solder joint is predictable. ALPHA TrueHeight Preforms contain embedded bondline control wires to ensure the minimum bondline thickness after reflow.

Solutions for Bondline Control - ALPHA TrueHeight Preforms

ALPHA TrueHeight Preforms contain embedded bondline control wires that control the minimum bondline of the solder joint after reflow.

Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline.

These preforms are available in a wide range of sizes, suitable for die attach, die top attach, clip attach connections, as well as, warped substrate attach applications.

ALPHA TrueHeight Solder Preform Power image

Products for Bondline Control

PRODUCT TYPE	PRODUCT NAME	COMPATIBLE SURFACE FINISH	PRODUCT APPLICATION METHOD	END APPLICATION
Bond line Control Preforms	ALPHA TrueHeight Preforms	All solderable surfaces	Pick & Place	Clip Attach / Substrate Attach

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