Low Temperature Solid Solders

Our low temperature solid solders come in a variety of alloys and forms including bars, ingots, solid wires and preforms.

Leading Low Temperature Alloys

ALLOY	Description	KEY FEATURES
SnBiAg	A lead-free alloy offer cost effective advantages and improved yield versus traditional SAC alloys.	Improved soldering yield for temperature sensitive components Decreased energy consumption with lower process temperature and shorter cycle time Good printing and reflow performance
HRL3	A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance versus existing low temperature alloys in the market.	Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
HRL1	A lead-free alloy engineered to exhibit improved drop shock performance versus existing low temperature alloys.	Highly controlled manufacturing process ensures alloy purity and consistency Low temperature processing results in >90% reduction in board warpage and component damage vs. SAC alloys Excellent drop shock and thermal cycling performance resulting in long service life for many electronic products

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