Die Attach - Sinter
Ensure reliable bonds with advanced sintering materials.
Learn MoreSilver and Copper Sintering Materials, Pastes and Films for Power Electronics & Modules
Advanced sintering, materials solder and copper solutions, pastes and films, ensuring optimal power electronics assembly and reliability.
Elevating Power Electronics Performance
Cutting-edge silver sintering paste, silver sintering films, preforms, and copper sintering paste to optimize power electronics performance. Our advanced sintering technology enhances thermal and electrical efficiency, ensuring reliable, high-performance assemblies.
Powerful, Reliable and Sustainable
Enhance Reliability in EV Applications
Our preforms and soldering solutions provide superior connectivity and thermal management, ensuring reliable performance in electric vehicles and beyond.
Boost Efficiency in Demanding Environments
Our sintering technology delivers strong, durable joints, enhancing the longevity and efficiency of power electronics in demanding environments.
Ensure High Precision and Reliability
Our sintering and soldering products offer high precision and reliability, ensuring connections in power electronics for automotive & industrial applications.
Optimize Heat and Stress Distribution
Our preforms are designed for optimal heat and stress distribution, enhancing performance and reliability in advanced electronic systems like Electric Vehicles (EVs).
Achieve Excellence in Modern Electronics
Our innovative power electronics products meet the evolving demands of power electronics, ensuring optimal performance in various applications.
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Power Electronics Preforms
Achieve precision with reliable solder preforms for power electronics.
Learn MoreWhy MacDermid Alpha?
Integrated Solutions
Our integrated power electronics solutions - including silver and copper sintering materials, pastes, films, and solder preforms - support die, package, and top attach applications with strong thermal and electrical performance. Designed for EV, industrial, and SiC-based systems, these RoHS-compliant semiconductor assembly materials improve thermal management, reduce thermal resistance, enhance energy efficiency, and deliver high-reliability interconnects for longer-lasting, high-performance power electronics.
Sustainability
PFAS-free, halogen-free, and RoHS-compliant power electronics materials support sustainable semiconductor assembly by reducing environmental and health risks while meeting stringent EH&S and global compliance requirements. Designed for EV, industrial, and energy applications, these low-emission materials enable responsible supply chains, improve regulatory readiness, and support ESG and sustainability goals while maintaining high-performance interconnect and assembly reliability.
Reliability
Our power electronics materials - including sintering and solder preforms - improve bond integrity, thermal cycling performance, and long-term reliability in power modules, SiC devices, EV systems, and industrial electronics. Engineered for die, package, and top attach applications, they deliver void-free interconnects, enhanced mechanical strength, and high thermal cycling endurance, ensuring stable, automotive-grade performance and long-life reliability in advanced semiconductor power electronics systems.
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Frequently Asked Questions
What is sintering material in semiconductor packaging and power electronics?
Sintering material is a metal-based die attach solution used in power electronics that bonds particles under heat and pressure to form a dense, void-free, and highly conductive joint. By enabling strong thermal conductivity and electrical performance, it improves thermal management, enhances bond integrity, and delivers long-term reliability and stability in high-temperature semiconductor packaging applications.
What are solder materials used for in electronics and power electronics?
Solder materials are used in electronics and power electronics to create reliable electrical and mechanical interconnects between components, substrates, and packages. They provide strong bonding, electrical conductivity, and thermal stability, supporting durable, low-resistance connections that enhance thermal performance and enable high-reliability, high-performance semiconductor and PCB assembly in high-power systems.
Are these semiconductor materials RoHS compliant?
Yes, our power electronics assembly materials are designed to meet Restriction of Hazardous Substances (RoHS) requirements, supporting lead-free manufacturing and environmentally responsible semiconductor assembly. These solutions enable global EH&S compliance, regulatory readiness, and sustainable production across advanced power electronics and electronic packaging applications. Product-level RoHS compliance should be confirmed for the specific sintering paste, film, or solder material selected.
How is sintering paste applied in semiconductor assembly and power electronics?
Sintering paste is commonly applied using stencil printing or precision dispensing to achieve controlled deposit volume and uniform bond-line thickness. This precise application ensures consistent coverage and enables high-reliability interconnects with strong thermal and electrical performance, supporting durable semiconductor packaging in power electronics applications.
What is the curing process in semiconductor assembly and power electronics?
The curing process is a controlled heating step used in semiconductor assembly to harden thermoset materials and activate final bond properties. In power electronics, proper curing ensures strong die, package, and top attach reliability, delivering enhanced mechanical strength, thermal stability, and long-term electrical and mechanical performance for durable semiconductor assembly.