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  • ALPHA® Argomax® 6500 Bond Pad

    SinteReady Bond Pad Supports Copper Wire bonding / Ribbon bonding

    • Hot tacking capable for assembly without glue dots
    • Target sinter bondline options of 12µm and 25µm
    • Customer defined dimensions, including foil thickness 
    • Fast hot tacking time for high throughput
    • Low sinter pressure, low sinter temperature
    • Tape and reel packaging
  • ALPHA® Argomax® 8035 Film

    Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach

    • Designed specifically for wafer dicing after lamination with dicing tape 
    • Formulated for Cu surface die attach
    • Film can be cut to custom sizes
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
  • ALPHA® Argomax® 8031 Film

    Sinter Silver Film for Die Attachment – Wafer Level Processing

    • Designed specifically for wafer dicing after lamination with dicing tape 
    • Formulated for Ag/Au surface die attach
    • Film can be cut to custom sizes
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
  • ALPHA® Argomax® 8021 Film

    Sinter Silver Film for Die Attachment

    • Die Transfer Film (DTF) process
    • Optimized for a wide range of surfaces
    • Customized for fast and easy die and clip lamination 
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
  • ALPHA® Argomax® 8020 Film

    Sinter Silver Film for Die Attachment

    • Die-Transfer-Film (DTF) process
    • Designed for Ag/Au surfaces
    • Customized for fast and easy die and spacer lamination 
    • Pure silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
    • Die attach temperatures suitable for semiconductor manufacturing 
       
  • ALPHA® Argomax® 8010 Film

    Sinter Silver Film for Large Area Lamination

    • Large area lamination film solution
    • Custom cut film sizes available
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing 
  • ALPHA® Argomax® 5040 Paste

    Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement 

    • Application: Die Attach, Die Top Attach
    • Formulated for printing or dot dispense on Cu surfaces
    • Designed for die placement on wet paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing  
  • ALPHA® Argomax® 5022 Paste

    Sinter Silver Paste for Die Attachment on Copper Surface

    • Application: Die Attach, Die Top Attach
    • Formulated for printing on Cu surfaces
    • Designed for die placement on dried paste
    • Pure Silver bond line for high performance and reliability 
    • High thermal and electrical conductivity 
    • Low sintering pressure for high yield manufacturing
  • ALPHA® Argomax® 2048 Paste

    Sinter Silver Paste for Package Sinter Attachment

    • Application: Package/Module Attach, Substrate Attach
    • Formulated for large area dispense on Ag/Au surfaces
    • Designed for component placement on wet paste with high tack
    • Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability 
    • Low sintering pressure for high yield manufacturing 
    • Design allows for thick dispense volumes providing bond lines suitable for large areas 
    • Flexible bondline thickness
  • ALPHA® Argomax® 2047 Paste

    Sinter Silver Paste for Package Sinter Attachment

    • Application: Package/Module Attach, Substrate Attach
    • Formulated for printing on Ag/Au surfaces
    • Designed for component placement on wet paste with high tack 
    • Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
    • Flexible bond line thickness 
    • Low sintering pressure for high yield manufacturing 
       
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