Product Overview

ALPHA HiTech CU31-2030's low viscosity characteristic enables fast and efficient flow properties at room temperature. Its high Tg and low modulus properties enables excellent reliability performance.

ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices.  All ALPHA HiTech products are halogen-free.

 

 

 

 

Product Features

  • Low Viscosity
  • Room temperature flow capability
  • High Glass Transition Temperature (Tg)
  • Low Modulus
  • Reworkable
  • Excellent reliability performance
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Technical Bulletins
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ALPHA HiTech CU31-2030 Underfill English

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ALPHA HiTech CU31-2030 底部填充剂 技术公告 简体中文

Brochures
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ALPHA HiTech Brochure English

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ALPHA HiTech 宣传册 简体中文

ALPHA HiTech CU31-2030 is excellent for portable electronics

ALPHA HiTech CU31-2030's low viscosity value of only 200 – 1000 cps allows it to fast flow beneath the component at 25.4°C, (see Table 1 below), enabling it to meet high throughput manufacturing requirements.  It also meets recent industry requirements for a higher Tg value, at least above 125°C of Thermal Cycling Test -40 +125°C [TCT].   ALPHA HiTech CU31-2030's Tg is 165°C and has been tested to pass 3000 TCT cycles on CVBGA360.  No reinforcement gave only 600 cycles pass.

At the right, Figure 1 illustrates the balance among attributes for this product.  Figure 2 shows its reworkable characteristics.

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Flow Rate Performance

 

Hitech table 1

 

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