Notebooks

Notebook computers available in the market today are extremely powerful with high capacity storage in a relatively small footprint. Manufacturers of notebook computers require joining materials which give them the greatest degree of flexibility in their board design.

Key Requirements

High mechanical and electrical reliability
Fine feature capable
Product options to enable flexibility in board design and manufacturing process
Excellent value, lowers total cost of ownership

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation around LED die to substrate attach.
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-363 SAC305 Repeatable printing down to 0.4mm/.016” pitch Low NWO and HIP Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch Low Temperature reflow
Solder Preforms	ALPHA Accuflux BTC-578 Solder Preforms Innolot / SAC305 / Low-Temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU31-2030 Fast flow Excellent Thermal Shock and Drop Shock Resistance Reworkable
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8000 ROL0 Passes SIR IPC J-STD-004B Excellent for high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

Reduced Voiding in Solder Joints

Key Requirements

High mechanical and electrical reliability
Fine feature capable
Product options to enable flexibility in board design and manufacturing process
Excellent value, lowers total cost of ownership

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation around LED die to substrate attach.
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-363 SAC305 Repeatable printing down to 0.4mm/.016” pitch Low NWO and HIP Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch Low Temperature reflow
Solder Preforms	ALPHA Accuflux BTC-578 Solder Preforms Innolot / SAC305 / Low-Temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU31-2030 Fast flow Excellent Thermal Shock and Drop Shock Resistance Reworkable
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8000 ROL0 Passes SIR IPC J-STD-004B Excellent for high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

Reduced Voiding in Solder Joints

What do you need solved?
Let our experts find your solution.

Notebooks

Products

Applications

Solutions