ALPHA HRL3 Solid Solder is designed to enable low temperature processes in selective and dip soldering processes. This alloy exhibits improved thermomechanical reliability performance versus existing low temperature alloys in the market. With the addition of special additives, ALPHA HRL3 demonstrates high mechanical properties, fast wetting and reduced Copper erosion performance in the soldering process.
ALPHA HRL3 is also suitable for low temperature, lead-free solder paste users who require a compatible low temperature alloy in Pin-Through-Hole (PTH) applications.
- Low temperature enabling in selective and dip soldering processes.
- Provides efficiencies in energy savings and reduces thermal damage.
- Comparable hole fill performance and solder joint strength vs SAC305.
- Low Copper erosion vs SAC305.
Enhanced Low Temperature Lead-Free Solid Solder
ALPHA HRL3 is suitable for use in low temperature selective soldering processes on through-hole joints, as well as in the dip soldering process. It enables soldering around ~ 200 - 260 °C, while delivering fast wetting and excellent soldering performance compared to SAC305. ALPHA HRL3 yields Class 3 hole fill solder joints with board thickness > 2.4mm and is low in Copper erosion. Contact your local sales representative for the recommended low temperature enabling liquid fluxes.
HRL3 Delivers Excellent Soldering Performance
ALPHA HRL3, with a special blend of additives, delivers high wetting performance and low Copper erosion, compared to SAC305 and Low Temp Alloy X.