High performance and reliability solution for clip attach
High-power packages such as MOSFETs, IGBTs, SODs demand ultra-low electrical resistance, high thermal conductivity, and fast switching performance. Compared with traditional wire-bond, clip attach provides lower RDS(on) with higher and symmetrical area, lower inductance, higher reliability, etc.
MacDermid Alpha offers high thermal, electrical, reliability and yield lead free solution for the clip attach. MacDermid Alpha clip attach materials provide high performance and robust drop-in solutions for wide manufacture process like printing, dispensing, jetting, etc.