Our products enable our valued customers to meet the evolving and demanding needs of the industry.
The ATROX brand of conductive and non-conductive die attach pastes and films are designed to provide you with superior performance for today's stringent reliability requirements.
MICROFAB product line is MacDermid Enthone’s leading brand and the standard for WLP. These products have constantly evolved to meet the quality and yield requirements of global IDM’s, OSAT’s and foundries. This line covers multiple metal stacks used in WLP. From copper for pillar, RDL, solder for C4 and cap, Ni for barrier to our gold portfolio.
The NOVAFAB product line represents MacDermid Enthone’s latest innovations in Cu, Ni, Pd, Ag and Au electroplating solutions enabling finer pitch and greater package customization. Our newest offerings are designed with the highest quality demands in mind to meet the challenges of expanding customer roadmaps in wafer level and advanced packaging.
Formulated to scavenge moisture, particles and hydrogen. Products cover a range of mechanical properties and application techniques.
Complete range of mechanical, electrical and thermal properties and may be used for temporary mounting or permanent bonding.
Advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.
Alpha paste flux offers industry leading soldering performance for semiconductor packaging applications with latest halogen-free flux technology to deliver high activity and robust application.
Kester paste flux offers industry leading soldering performance for semiconductor packaging applications with latest halogen-free flux technology to deliver high activity and robust application.
Pure Indium Solder TIM.
High purity, stable materials and production processes from a century of experience.
Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.
ALPHA Argomax sinter and die attach solutions are designed to meet and even exceed the demanding quality standards for electric vehicle and power electronics manufacturers.
TrueHeight Preforms are designed to deliver consistent and predictable bondline thickness (BLT) and minimize die tilt during component and board assembly.
As global specialists for the electronics industry, the Electrolube brand offers a vast array of products including thermal management materials, conformal coatings, and encapsulation resins.