High-reliability electroless copper plating for demanding PCB applications, delivering optimal performance for multilayer boards.
Our M-Copper and Via Dep electroless copper processes deliver unparalleled reliability, superior adhesion, and stress-free copper deposition for demanding applications, backed by global support and industry-leading technologies.
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Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
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Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
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We offer a comprehensive portfolio of electroless copper, direct metallization, and final finishes to ensure high-quality, consistent plating across all board materials.
Sustainability
Our precious metal-free primary metallization solutions reduce resource usage, minimize waste, and support sustainable, efficient Printed Circuit Board (PCB) fabrication.
Reliability
Our direct and electroless copper primary metallization processes deliver exceptional reliability for high-speed, multilayer, and advanced printed circuit boards.
Electroless copper plating is a process that makes holes conductive by conditioning a non-conductive surface, applying a palladium layer, and then depositing copper. The result is an even, high-quality copper deposit, perfect for applications such as PCBs, microvias, and flexible circuits.
Electroless copper plating is widely used in applications such as PCBs, flexible circuits, High-Density Interconnects (HDI), microvias, and components requiring high-reliability copper deposition. It is also crucial for complex substrates, including polyimides and high-frequency materials.
Electroless copper enhances PCB performance by providing a consistent, uniform coating with superior adhesion. This improves conductivity, reduces signal loss, and boosts reliability, especially in fine-line and microvia applications where precision is critical.
Key features of electroless copper plating include excellent adhesion, uniform deposition on complex and non-conductive surfaces, stress-free copper layers, and compatibility with various substrate types. It also enables plating of fine lines, microvias, and intricate designs, making it ideal for high-performance applications like Modified Semi-Additive Process (mSAP) designs.
Choosing the right electroless copper plating process depends on factors such as substrate type, required copper thickness, application needs, and environmental considerations. For high-reliability applications, it’s important to select processes that ensure stress-free copper deposition, superior adhesion, and compatibility with complex designs.
