High yield and reliability solutions for flip chip attach

High performance semiconductors driving high I/O connections through fine pitch copper pillar and micro-bumps. Evolving substrate design for fine pitch such as Embedded Trace Substrate (ETS) technology coupled with low cost metallization such as organic solderability preservative (OSP) on copper creating challenges for flip chip solder interconnect. MacDermid Alpha flip chip materials enable the manufacture of robust, reliable semiconductor package that exceed reliability requirements for drop shocks and thermal stresses.

MacDermid Alpha flip chip attach solutions include high activity water soluble flux typically for high performance large flip chip package size. Low residue No Clean flip chip flux for leadframe based substrate, MEMs and NEMs sensors that are sensitive to moisture and flux residue are also available.

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