Increased Performance and Enhanced Cost-effectiveness
Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry and provide the throughput and yields for your business needs.
Industry Leading Technology and Product Portfolios
From our cutting-edge Damascene* process used in the most advanced nodes in wafer fabrication to our best in class thermal management in backend packaging, we are leaders in materials for heterogenous integration.
*Through partnership with Entegris, Inc.