Increased Performance and Enhanced Cost-effectiveness

Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry and provide the throughput and yields for your business needs.

Industry Leading Technology and Product Portfolios

From our cutting-edge Damascene* process used in the most advanced nodes in wafer fabrication to our best in class thermal management in backend packaging, we are leaders in materials for heterogenous integration.

*Through partnership with Entegris, Inc.

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