Semiconductor

We are a leading supplier of wet chemicals, attachment materials, and photomasks used to fabricate wafers and manufacture the most advanced electronic packages on the market today.

Increased Performance and Enhanced Cost-effectiveness

Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry and provide the throughput and yields for your business needs.

Industry Leading Technology and Product Portfolios

From our cutting-edge Damascene* process used in the most advanced nodes in wafer fabrication to our best in class thermal management in backend packaging, we are leaders in materials for heterogenous integration.

*Through partnership with Entegris, Inc.

Key Products for Semiconductor

PRODUCT TYPE	KEY PRODUCTS	FEATURES
Die Attach		Hybrid Silver Sintering Superior Reliability Low outgassing Excellent moisture resistance
Solder Flux	OA1303	Excellent activity allows for superior wetting, maximizing wetting and bump reforming Best adapted to bump forming process of lead-free SAC alloys Excellent cleanability; residues are easily cleaned with DI water Suitable for various wafer sizes up to 300mm
Plating-Copper		Pillar / Post RDL Viafill Hybrid Bonding Thermal Pillar TSV
Plating-Nickel		Pillar / Post RDL Viafill Hybrid Bonding Thermal Pillar TSV
Plating-Precious Metal		Cyanide Free High Hardness Gold Viafill Superior Step Coverage Deplate Strike
Plating-Solder		Hybrid CD Leveling High Speed Excellent alloy distribution Solder Plating (Sn/Ag) (Sn) (In) Low temperature solder Ultra-low alpha Low alpha

Key Products for Semiconductor

PRODUCT TYPE	KEY PRODUCTS	FEATURES
Die Attach		Hybrid Silver Sintering Superior Reliability Low outgassing Excellent moisture resistance
Solder Flux	OA1303	Excellent activity allows for superior wetting, maximizing wetting and bump reforming Best adapted to bump forming process of lead-free SAC alloys Excellent cleanability; residues are easily cleaned with DI water Suitable for various wafer sizes up to 300mm
Plating-Copper		Pillar / Post RDL Viafill Hybrid Bonding Thermal Pillar TSV
Plating-Nickel		Pillar / Post RDL Viafill Hybrid Bonding Thermal Pillar TSV
Plating-Precious Metal		Cyanide Free High Hardness Gold Viafill Superior Step Coverage Deplate Strike
Plating-Solder		Hybrid CD Leveling High Speed Excellent alloy distribution Solder Plating (Sn/Ag) (Sn) (In) Low temperature solder Ultra-low alpha Low alpha

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