Highest Purity and Exacting Dimensions

ALPHA Solder Spheres are made to the highest quality control standards to ensure consistent sphere size, uniformity, and alloy content.

ALPHA Solder Sphere alloys are manufactured using a proprietary alloying process to ensure very low levels of oxides or other impurities. The very low oxide levels promise strong, clean and well-formed solder bumps and joints coupled with a suitable flux and process profile.

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  • ALPHA® Tin Silver Copper Lead Free Solder Spheres

    ALPHA Lead Free Solder Spheres are designed for BGA, CSP, and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters.

    • Standard industry tin silver copper (SAC) alloy.
    • SAC105
    • SAC305
    • SAC405
    • SAC125N
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  • ALPHA® SACX0307 Lead Free Solder Spheres

    ALPHA SACX0307 Lead-Free Solder Spheres are patented low silver lead-free alloys for market leading drop-shock resistance. The spheres are designed for BGA, CSP, and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters.

    • Patented low silver lead-free alloys for market leading drop-shock resistance
    • Highest drop shock resistant
    • Excellent thermal cycling performance
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  • ALPHA® MAXREL Series Lead-Free Solder Spheres

    ALPHA MAXREL Series Lead-Free Solder Spheres are patented high silver containing lead-free alloys for market leading thermal cycling reliability and drop-shock resistance. The spheres are designed for BGA, CSP and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters.

    • Patented high silver containing lead-free alloys for highest thermal cycle fatigue resistance
    • Excellent drop shock resistance
    • MAXREL alloy
    • MAXREL PLUS alloy - Antimony free alloy
       
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  • ALPHA® Leaded Solder Spheres

    ALPHA Leaded Solder Spheres are designed for BGA, CSP and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters.

    • Standard industry tin-lead based alloy
    • Sn63/Pb37
    • Sn62/Pb36/Ag2
       
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  • ALPHA® HRL Series Low Temperature Solder Spheres

    ALPHA HRL Series Lead-Free Solder Spheres are patented low temperature melting point lead free alloys for market leading drop-shock and thermal cycling resistance. The spheres are designed for BGA, CSP and wafer bumping applications. ALPHA Solder Spheres are available in a variety of common diameters.

    • Patented lead-free low melting point alloys for high reliability performance
    • Low liquidus point
    • Thermal cycle and drop shock reliability matching SAC alloy
    • HRL1 alloy
    • HRL3 alloy
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