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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
Features
- High thermal printable hybrid silver sintered die attach.
- High power semiconductor packages.
- Low resin bleed out.
- Low condensable organics.
Technical Data Sheet
ATROX 800HT2V-P1 Die Attach TDS English
ATROX 800HT2V-P1
ATROX 800HT2V-P1 is a thermosetting conductive printable die attach adhesive with very high thermal conductivity designed for high power semiconductor packages. ATROX 800HT2V-P1 has low resin bleed out and low condensable organics which ensure excellent package reliability.
ATROX 800HT2V-P1
|
Product Name |
Die Attach Format |
DA Funcitional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX 800HT2V-P1 |
Paste |
Conductive |
Polymer |
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