Improve Your Throughput and Yield
Bring your most innovative designs to market that require lighter weight, strength and reliability that only MacDermid Alpha performance materials can provide. Our comprehensive experience in metallization and assembly materials, combined with intensive R&D and regional applications, support the necessary framework for scalable solutions of complex package assemblies where yields and throughput are challenged.
Innovation is in our DNA
Our innovations for mobile package applications include: copper damascene, copper pillar, copper Redistribution Line (RDL), backside metal, barrier metals, solder cap, paste and fluxes, die attach adhesives, hybrid sintering, thermal interface materials, and re-workable adhesive pastes and films. Our efforts are aimed to enable your business and technology roadmaps.