Industry leading Sphere attach solutions

Finer pitch design and lower cost substrate metallization drive advancement in sphere attach application. Smaller sized solder spheres are required for smaller form factor packages. Sphere attach fluxes are mostly water soluble, while some BGA design may require highly active no clean flux or solder paste.

MacDermid Alpha has a full suite of sphere attach solutions ranging from solder spheres to water soluble and no clean flux solutions

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