Market leading solutions for Component/Passives attach

Advancement in semiconductor technology coupled with market growth for small form factor devices with multiple functionalities is driving heterogenous integration through SiP (System-in-Package). The ability to solder connect active and passives components on a SiP package is critical and one of the key material is solder paste. MacDermid Alpha provide a wide portfolio of solder paste to enable high density, fine pitch component attach.

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