Product Overview

MICROFAB SN-300 / 302 process is a high speed, MSA based pure Tin process. MICROFAB SN-300 / 302 produces fine-grained, matte to semi-bright pure tine deposit. The formulation is developed to produce wafer bumps with excellent thickness distribution across the wafer, as well as a uniform alloy distribution.

Features

  • Pure tin
  • Low alpha
  • Matte
  • High Speed
  • Lead-free

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Pre-Reflow

Solder plating- Macdermid Alpha

Pillar Stack Annealed for 250 Hours at 1500C

Solder plating- Macdermid Alpha

MICROFAB SN-300 / 302

Product Name

Solder Type

Surface Type

Peformance Feature

EHS

MICROFAB SN-300 / 302

Pure Tin
Low Alpha
Ultra-low Alpha

Matte

High Speed

Lead-Free

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

  • Pillar/Post, RDL
  • Thermal pillar
  • Solder cap and C4
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

  • Pillar/Post, RDL
  • Thermal pillar
  • Solder cap and C4
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration Optoelectronics Packaging

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration Optoelectronics Packaging

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

  • Pillar/Post, RDL
  • Thermal pillar
  • Solder cap and C4
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

  • Pillar/Post, RDL
  • Thermal pillar
  • Solder cap and C4
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration Optoelectronics Packaging

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration Optoelectronics Packaging

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL
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