Product Overview

MICROFAB SN-350 Tin bump plating bath is an organic sulfonate-based electrolyte, for high speed electro-deposition of smooth fine-grained, uniform Tin bumps. The chemistry is robust enough for both bumping and capping a wide range of patterned wafers. It exhibits good post-reflow with-in die (WID) bump thickness uniformity over a wide range of wafer types, which demonstrates its suitability for high-volume manufacturing.

Features

  • Pure tin
  • Low alpha
  • Smooth deposit
  • Excellent coplanarity
  • Low surface roughness
  • High speed
     

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Tin-MSA based solution combined with a two-part additive system.

MICROFAB SN-350 is a Tin-MSA based solution combined with a two-part additive system for easy bath metrology and maintenance. It exhibits excellent WID and WIW height uniformity and is compatible with soluble and insoluble anodes.

Plating Solder-Macdermid Alpha

MICROFAB SN-350

Solder plating- Macdermid Alpha

MICROFAB SN-350

Product Name

Solder Type

Surface Type

Peformance Feature

EHS

MICROFAB SN-350

Pure Tin
Low Alpha
Ultra-Low Alpha

Smooth Deposit Excellent

Coplanarity Low Surface

Roughness

High Speed

Lead-Free

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL
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