MICROFAB® TS-650 NXG
Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps.
Contact UsProduct Overview
MICROFAB TS-650 NXG is the tin-silver bump, pillar, and capping metallization process for wafer level packaging designs where coplanarity, bond strength, and optimized process throughput are the goals. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG reduces the propensity for whiskering while providing a lower melting point for reflow and higher resistance to mechanical stress.
Product Features
Organic Sulfonate-Based Electrolytes for Semiconductor Wafer Plating
The process is suited for high-speed electrodeposition, producing smooth surface morphology, solderable reflowed bumps with tight control of alloy compositions.
Pre-Reflow Uniformity, Wide Process Window, Tin-Silver Capping
Designed for lead-free and capping applications, MICROFAB TS-650 NXG provides exceptional uniformity Within-Wafer (WIW), Within-Die (WID), and Within-Feature (WIF).
Industry Leading Copper Pillar Plating Technologies
MICROFAB TS-650 NXG is the coating of choice for excellent solderability of chip or package to substrate.
Excellent WID / WIW Height Uniformity
MICROFAB TS-650 NXG is void-free post-reflow and offers excellent WID/WIW height uniformity. It exhibits high stability and resist compatibility, with a wide process window that allows deposition rates of 6-15 ASD. With high-speed plating capabilities, the process provides a smooth and regular coating of highly solderable tin-silver on a multitude of fine-pitch packaging designs.
Bumping and Capping Solution
MICROFAB TS-650 NXG is designed for a wide range of flip chip, Fan-Out Wafer Level Packaging (FOWLP), and 2.5D/3D bumping applications with higher plating speeds. It is an MSA-based tin-silver process combined with a three-part additive system. The process is also suitable for C4 bumping (mushroom, in-via), mBump, and capping applications. MICROFAB TS-650 NXG provides smooth-as-plated deposit morphology, excellent Ag% control, and uniformity.
Featured Applications
Bumping and Capping
MICROFAB TS-650 NXG is designed for a wide range of flip chip, FOWLP, 2.5D/3D bumping, C4 bumping (mushroom, in-via), mBump, and capping applications.
Product Documentation
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