Nickel Solutions
Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits.
Contact UsProduct Overview
Our MICROFAB® Nickel solutions include sulfamate nickel, barrier electroplating processes designed to provide pure, ductile, fine-grained, low stress, matte nickel deposits. These processes are developed to meet the needs of the semiconductor industry for quality assured chemistry. Our MICROFAB Nickel solutions include MICROFAB EVF NiBAR, MICROFAB Ni-200, and MICROFAB Ni-100.
Product Features
Barrier Technology for High Performance Packages
MICROFAB Nickel solutions provide high speed deposition with bright, smooth, stress tunable, fine-grained deposits.
Boric Acid-Free Options for Regulatory Compliance
MICROFAB EVF NiBAR is the leading boric acid-free electrolytic nickel for barrier, via fill, bump, Under-Bump Metallization (UBM) and Redistribution Layer (RDL) applications.
MICROFAB EVF NiBAR
MICROFAB EVF NiBAR is the next generation of nickel barrier technology that is stress and via fill selectable. The low temperature process produces a pure, ductile, fine-grained, low stress nickel deposit with excellent coplanarity. MICROFAB EVF NiBAR is manufactured to meet the exacting performance and manufacturing requirements associated with wafer plating and contains no boric acid in compliance with specific regulatory needs.
MICROFAB Ni-100
MICROFAB Ni-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, low stress nickel deposit required to meet the needs of the semiconductor industry.
MICROFAB Ni-200
MICROFAB Ni-200 is an industry leading sulfamate nickel electroplating process that produces a pure, ductile, fine-grained, bright, low stress nickel deposit required to meet the needs of the semiconductor industry.
Featured Applications
Barrier Technology
MICROFAB Nickel Solutions are part of our historic POR barrier technology and tool OEM BKM.
Via Fill
MICROFAB EVF NiBAR is a direct barrier replacement for our historical POR MICROFAB NI200B that is viafill capable and stress adjustable.
Product Documentation
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