Product Overview

MICROFAB NI-200 is a sulfamate nickel electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.

Features

  • High speed 
  • Bright/smooth
  • Small grain size
  • Lead-free
     

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MICROFAB NI200 – Bright Barrier

MICROFAB NI-200 is an industry leading sulfamate nickel electroplating process that produces a pure, ductile, fine-grained, bright low stress nickel deposit required to meet the needs of the semiconductor industry.

  • Bright/Smooth
  • Barrier
  • Small grain
Plating Nickel -Macdermid Alpha

MICROFAB NI-200

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

MICROFAB NI-200

Barrier

Bright/Smooth
High Speed
Small Grain size

Lead-Free

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
     
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB EVF NiBAR

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
     
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB EVF NiBAR

MICROFAB NI200B – Bright Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

MICROFAB NI200B – Bright Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

MICROFAB NI-200 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

MICROFAB NI-200 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
     
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB EVF NiBAR

Key Barrier Materials, Copper Pillar and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill 
  • Barrier
     
MICROFAB SPM 1100 MICROFAB MP 2500 MICROFAB SC40 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB AU660 MICROFAB NI-100 MICROFAB EVF NiBAR

MICROFAB NI200B – Bright Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

MICROFAB NI200B – Bright Barrier

Part of MacDermid Alpha’s historic POR barrier technology and tool OEM BKM.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

MICROFAB NI-200 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

MICROFAB NI-200 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4.

UBM Thermal Management Wafer Bumping Pillar / Post
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