Product Overview

MICROFAB NI-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, low stress nickel deposit required to meet the needs of the semiconductor industry for performance and manufacturing requirements associated with wafer plating.

Features

  • High speed deposition
  • Matte
  • Lead-free

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Nickel Sulfamate Electroplating Process

MICROFAB NI-100 is a nickel sulfamate electroplating process that produces a pure, ductile, fine-grained, matte, low stress nickel deposit required to meet the needs of the semiconductor industry.

Image
Plating Nickel -Macdermid Alpha

MICROFAB NI-100

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

MICROFAB NI-100

Barrier

Matte
High Speed

Lead-Free

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