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Fine Feature Enabling Adhesives
We offer a uniquely designed underfill containing smaller particles and optimized fluidity for low standoff, fine pitch penetration
Leading Fine Feature Enabling Adhesives
| PRODUCT NAME | DESCRIPTION | KEY FEATURES |
|---|---|---|
| ALPHA HiTech CU31-2030 | ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards. |
|
Solder pastes and cored wire designed to enable the assembly of high density board designs that include fine feature, tightly spaced components.
Solder pastes and cored wire designed to enable the assembly of high density board designs that include fine feature, tightly spaced components.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
Solder pastes and cored wire designed to enable the assembly of high density board designs that include fine feature, tightly spaced components.
Solder pastes and cored wire designed to enable the assembly of high density board designs that include fine feature, tightly spaced components.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
Let our experts find your solution.