Product Overview

ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.

ALPHA HiTech CU11-3127 has a unique low viscosity property, making it possible to secure full coverage flow at room temperature without preheat.  For a faster flow rate, preheat of < 80°C is recommended on substrates during dispensing process.

 

 

 

 

Product Features

  • Enabling fast and efficient flow properties at high temperature but must be <80°C
  • Releases stress over a large area, primary stress is CTE mismatch between component and board
  • High Glass Transition Temperature
  • Low Coefficient of Thermal Expansion
  • Halogen Free Complies with RoHS Directive 2011/65/EU
Technical Bulletins
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Documentation icon - Technical Bulletin

ALPHA HiTech CU11-3127 Underfill Technical Bulletin English

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Documentation icon - Technical Bulletin

ALPHA HiTech CU11-3127 底部填充剂 技术公告 简体中文

Brochures
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ALPHA HiTech Brochure English

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 Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

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ALPHA HiTech CU11-3127 Diagram

Underfill For Exceptional Thermal Fatigue Resistance

Stand alone SAC solder joints in BGA and CSP assemblies tend to falter in thermally harsh automotive applications. High Tg and low CTE underfill [UF] is a reinforcement solution.  ALPHA HiTech CU11-3127 has a high Tg of 177°C and low CTE1 of 29 ppm. Rework not a requirement allows higher filler content in formulation to develop such attributes.  While it is possible to secure complete coverage during dispensing at 25°C, preheating  the substrates, not more than 80°C, during dispensing can significantly improve the flow rate. 

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