Leading High Reliability Adhesives

ALPHA HITECH CF31-4010 A halogen-free, epoxy- based material to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices.
  • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
  • High Tg and low CTE values drastically improve ability to pass more Stringent Thermal Cycling Test  
  • Reworkable


A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.  A high glass transition temperature [Tg] and low coefficient thermal expansion [CTE] underfill results in a high reliability solution.

  • Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
  • High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
  • Excellent Thermal Cycling Test performance
ALPHA HiTech CU31-2030

a low viscosity underfill which enables fast and efficient flow properties at room temperature. Its high Tg and low modulus properties enables excellent reliability performance. Suitable for assembling BGA, CSP and Flip Chip devices.  All ALPHA HiTech products are halogen-free.

  • Low Viscosity
  • Room temperature flow capability
  • High Glass Transition Temperature (Tg)


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