ALPHA HiTech CU13-3150 does not contain any fillers and is reworkable.
Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
This adhesive is an excellent option for processes requiring curing temperature as low as 80°C.
- Low Viscosity
- Fast Cure at Low Temperature
- Excellent Adhesion
- Excellent Drop Shock
- Complies with RoHS Directive 2011/65/EU
Underfills developed to match assembly requirements of specific markets
Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component allowing it to pass reliability tests such as drop shock, impact bend, and thermal cycle.
ALPHA HiTech Underfills are developed to match assembly requirements of specific market segments.