Product Overview

ALPHA HiTech CU13-3150 does not contain any fillers and is reworkable.

Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.  

This adhesive is an excellent option for processes requiring curing temperature as low as 80°C.  

 

 

 

 

Product Features

  • Low Viscosity
  • Fast Cure at Low Temperature
  • Excellent Adhesion
  • Excellent Drop Shock
  • Reworkable
  • Halogen-free
  • Complies with RoHS Directive 2011/65/EU
Technical Bulletins
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ALPHA HiTech CU13-3150 Underfill English

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Documentation icon - Technical Bulletin

ALPHA HiTech CU13-3150 底部填充剂 技术公告 简体中文

Brochures
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ALPHA HiTech Brochure English

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 Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

Underfills developed to match assembly requirements of specific markets

Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component allowing it to pass reliability tests such as drop shock, impact bend, and thermal cycle. 

ALPHA HiTech Underfills are developed to match assembly requirements of specific market segments.

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ALPHA HiTech CU13-3150 Image
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