Product Overview

ALPHA HiTech EN31-4007B's excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process.

This product has been tested to provide excellent Adhesion on FR4, Flexible Polyimide (FPC) and PET substrates.

Users also have the option to rework as required since the product is highly reworkable.

 

 

 

 

Product Features

  • Excellent Impact Bending
  • Excellent Drop Shock
  • Excellent Impact Resistance
  • Highly Reworkable
  • Possesses Waterproofing Property
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Technical Bulletins
Documentation icon - Technical Bulletin

ALPHA HiTech EN31-4007B Encapsulant English

Brochures
Documentation icon - Brochure

ALPHA HiTech Brochure English

Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

Encapsulant for Reinforcement Protection

The low modulus property of ALPHA HiTech EN31-4007B presents the product with excellent flexibility capability very suitable for chip components assembly on flexible circuit or very thin board.  

It has excellent adhesion FR4 and is also very reworkable

ALPHA HiTech EN31-4007B Diagram

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN21-4210F Encapsulant

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN21-4210F Encapsulant

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN21-4210F Encapsulant

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN21-4210F Encapsulant

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
What do you need solved?
Let our experts find your solution.
Contact Us