ALPHA HiTech SM42-1311 is ideal for high-speed dispensing processes given its non-sagging property.
It has been tested to provide excellent adhesion after curing. This product can also be printed.
- Rheology specially designed for high throughput dispensing process
- Excellent adhesion on common PCB board materials
- Excellent thermal resistance during wave soldering process
- Complies with RoHS Directive 2011/65/EU
A dispensing designed adhesive for holding parts in soldering process
ALPHA HiTech SM42-1311 offers excellent adhesion strength at high temperature to prevent components from dropping off during wave soldering or SMT process.