Leading Products in Gluing SMT components

  • Excellent adhesion to FR4
  • Dispensible and Printable
  • Fast Curing
  • Resistant to high temperature
PRODUCT DESCRIPTION KEY FEATURES
ALPHA HiTech SM42-120P Adhesive A one component, fast curable surface mount adhesive, specially designed for screen printing. 
  • Rheology specially designed for high throughput printing process
  • Non-Sagging
  • Excellent adhesion on common PCB board materials
ALPHA HiTech SM42-1311 Adhesive A one component, fast curable surface mount adhesive designed for dispensing applications.  
  • Rheology specially designed for high throughput dispensing process
  • Excellent adhesion on common PCB board materials
  • Excellent thermal resistance during wave soldering process

 

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Robotic Soldering Manual Soldering and Rework

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Robotic Soldering Manual Soldering and Rework

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Soldering Alloys Cored Solder Wire Solder Preforms HiTech Adhesives and Encapsulants

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Robotic Soldering Manual Soldering and Rework

Through hole components are generally heavier, carry more current or subject to greater mechanical strain (i.e. connectors) and subsequently require more solder volume. Our products are designed to meet the challenges of through hole soldering. 

Wave Soldering Selective Soldering Robotic Soldering Manual Soldering and Rework

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