Product Overview

ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes. 

Processing (lamination, dicing, pick-up) of ALPHA Argomax 8031 may vary based on die size, wafer thickness and type, etc.

Contact us to discuss your specific application.

 

 

 

Product Features

  • Designed specifically for wafer dicing after lamination with dicing tape 
  • Formulated for Ag/Au surface die attach
  • Film can be cut to custom sizes
  • Pure silver bond line for high performance and reliability 
  • High thermal and electrical conductivity 
  • Low sintering pressure for high yield manufacturing 
  • Die attach temperatures suitable for semiconductor manufacturing 
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ALPHA Argomax Power Electronics Brochure English

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ALPHA Argomax 功率电子 宣传册 简体中文

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ALPHA Argomax 8031 wafer

Wafer Level Sintering Die Attach Film

ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film that is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.

After lamination on the wafer back-side, the film can be diced in a regular saw dicing machine. The diced laminated dies can be picked / placed using standard die bonders (including epoxy, soft solder). The sintering of the placed dies can be accomplished using low temperatures and pressures due to our proprietary silver particles

After sintering, ALPHA Argomax 8031 film produces a high purity, high thermal and electrical conductivity diffusion bond between the die and substrate.

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