ALPHA Argomax 2010C paste is a specifically designed sintering paste for high-volume, low-pressure sintering die attachment with a design that promotes consistent, uniform printing with long stencil life, even for large dies.
- Applications: Die Attach, Die Top Attach
- Formulated for printing on Ag/Au surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
ALPHA Argomax 2010C paste is a silver sintering die attach material specifically designed for die placement on dried paste followed by low-pressure sintering.
After sintering, it forms a high thermal and electrically conductive pure silver bond between the die and substrate. This high quality bond enables increased reliability (product life) and higher performance (higher power density).
|PRODUCT TYPE||PRODUCT NAME||Compatible Surface Finish||Product Application Method||End Application|
|Sinter Paste||ALPHA Argomax 2040 Paste||Ag, Au||Print, Dot Dispense||Die Attach, Die Top Attach|
|Sinter Paste||ALPHA Argomax 5022 Paste||Cu||Die Attach, Die Top Attach|
|Sinter Film||ALPHA Argomax 8020 Film||Ag, Au||Die Transfer Film||Die Attach, Die Top Attach, Spacer Attach|
|Engineered Sinter Product||ALPHA Argomax 6500 Bond Pad||Ag, Au, Cu||Pick & Place||Die Attach, Die Top Attach, Spacer Attach|
|Engineered Sinter Product||ALPHA Argomax 9200 Preform||Ag, Au||Pick & Place||Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach|