Product Overview

ALPHA Argomax 2040 is a silver sintering die attach paste specifically designed for die placement on wet paste (before drying) followed by low-pressure sintering.   

 

 

 

 

Product Features

  • Applications: Die Attach, Die Top Attach
  • Formulated for printing or dot dispense on Ag/Au surfaces 
  • Designed for die placement on wet paste
  • Pure Silver bond line for high performance and reliability 
  • High thermal and electrical conductivity 
  • Low sintering pressure for high yield manufacturing  
  • Proven long stencil life
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ALPHA Argomax Power Electronics Brochure English

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ALPHA Argomax 功率电子 宣传册 简体中文

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ALPHA Argomax Paste Jar

Proven reliability in EV drivetrain applications

ALPHA Argomax 2040 Paste is a silver sintering die attach material specifically designed for die placement on wet paste (before drying) followed by low-pressure sintering.

After sintering, it forms a high thermal and electrically conductive pure silver bond between the die and substrate.

This high quality bond enables increased reliability (product life) and higher performance (higher power density).

Related Products

Product Type Product Name Compatible Surface Finish Product Application Method End Application
Sinter Paste ALPHA Argomax 2010C Paste Ag, Au Print Die Attach, Die Top Attach
Sinter Paste ALPHA Argomax 5022 Paste Cu Print Die Attach, Die Top Attach
Sinter Film ALPHA Argomax 8020 Film Ag, Au Die Transfer Film Die Attach, Die Top Attach
Engineered Sinter Product ALPHA Argomax 6500 Bond Pad Ag, Au, Cu Pick & Place Die Top Attach
Engineered Sinter Product ALPHdA Argomax 9200 Preform Ag, Au Pick & Place Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

 

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