ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.
Specifically designed as a film solution for wafer lamination for die attach onto bare copper surfaces, ALPHA Argomax 8035 innovative film provides a solution at the wafer level, providing customers with die pre-laminated with ALPHA Argomax.
Processing (lamination, dicing, pick-up) of ALPHA Argomax 8035 may vary based on die size, wafer thickness and type etc.
Contact us to discuss your specific application.
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Cu surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film that is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.
After lamination on the wafer back-side, the film can be diced in a regular saw dicing machine. The diced laminated dies can be picked / placed using standard die bonders (including epoxy, soft solder). The sintering of the placed dies can be accomplished using low temperatures and pressures due to our proprietary silver particles
After sintering, ALPHA Argomax 8035 Film produces a high purity, high thermal and electrical conductivity diffusion bond between the die and substrate.
|Product Type||Product NAME||Compatible Surface Finish||Product Application Method||End Application|
|Sinter Paste||ALPHA Argomax 5022 Paste||Cu||Die Attach, Die Top Attach|
|Sinter Paste||ALPHA Argomax 5040 Paste||Cu||Print, Dot Dispense||Die Attach, Die Top Attach|
|Sinter Film||ALPHA Argomax 8031 Film||Ag, Au||Wafer Lamination||Wafer Lamination|
|SinteReady Product||ALPHA Argomax 6500 Bond Pad||Ag, Au, Cu||Pick & Place||Die Top Attach|
|SinteReady Product||ALPHA Argomax 9500 Preform||Cu||Pick & Place||Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach|