Product Overview

ALPHA Argomax 6500 Bond Pad is a SinteReady copper foil used for die top attachment, enabling the use of copper wire bonding and ribbon bonding for power connections.  

Bond Pad is laminated with ALPHA Argomax film and is sintered to the die top, providing a robust surface for copper wirebond and ribbon bond connections. 

 

 

 

 

Product Features

  • Hot tacking capable for assembly without glue dots
  • Target sinter bondline options of 12µm and 25µm
  • Customer defined dimensions, including foil thickness 
  • Fast hot tacking time for high throughput
  • Low sinter pressure, low sinter temperature
  • Tape and reel packaging
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ALPHA Argomax Power Electronics Brochure English

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 Documentation icon - Brochure

ALPHA Argomax 功率电子 宣传册 简体中文

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Benefits of ALPHA SinteReady Bond Pads

SinteReady Bond Pads provide a flexible die top interconnect solution by enabling easy to program copper wirebonding and copper ribbon bonding operations.

Copper wirebonds and ribbon bonds provide significantly higher reliability compared to aluminum wirebonds, but require a robust bonding surface, created with ALPHA Argomax Bond Pad.

Key Benefits of SinteReady™ Products

  • No printing / dispensing or drying time compared to sinter paste
  • Repeatable bondlines based on ALPHA Argomax film

Product Type

Product Name

Compatible Surface Finish

Product Application Method

End Application

Engineered Sinter Product

ALPHA Argomax 6100 Laminated Clips

Ag, Au, Cu

Pick & Place

Die Top to Substrate

Engineered Sinter Product

ALPHA Argomax 9200 Preforms

Ag, Au

Pick & Place

Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

Engineered Sinter Product

ALPHA Argomax 9500 Preforms

Cu

Pick & Place

Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

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