Hard Drives, SSD and Memory

Storage devices are used across a spectrum of electronic devices and are built in controlled manufacturing environments. Manufacturers value joining material quality and repeatable processing performance to meet their high quality standards.

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Wide processing window
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Wide processing window
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

What do you need solved?
Let our experts find your solution.

Hard Drives, SSD and Memory

Products

Applications

Solutions