High Performance and Yield Solution for Die Attach
Die attach is a critical process to ensure the package with high reliability and performance. The advancing semiconductor technologies demands high performance die attach solutions. MacDermid Alpha offers a wide range of die attach materials to cater to the challenging automotive, mobile: RF, Telecom, and industrial electronics.
MacDermid Alpha die attach portfolio contains a broad range of conductive paste and film adhesives. The market leading hybrid and full silver sintering pastes are our premium product lines for extremely high power and reliability packages. Our 2 in 1 conductive film products contain the highest thermal conductivity film in the world, especially designed for high integrated novel applications. We also offer universal solution with high reliability for broad and diversified applications.