Product Overview

The MICROFAB CU1000 process is engineered for high-speed bump and pillar applications. The product is formulated, packaged, and quality control is performed according to the needs of the semiconductor industry.

Features

  • High speed 
  • Excellent coplanarity
  • Ease-of-use

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Capable of plating rates > 3um/min

Copper plating- Macdermid Alpha

 

Copper plating- Macdermid Alpha

MICROFAB CU1000

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB CU1000

Pillar/Post
RDL

High Speed
Good Coplanarity

Ease-of-Use

Key Barrier Materials and Solders to Produce High Reliability Interconnects.

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects.

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects.

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects.

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post
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