Product Overview

ALPHA Argomax 5022 Paste is a silver sintering die attach paste specifically designed for low pressure sintering die attachment on copper finish surfaces. 

 

 

 

 

Product Features

  • Application: Die Attach, Die Top Attach
  • Formulated for printing on Cu surfaces
  • Designed for die placement on dried paste
  • Pure Silver bond line for high performance and reliability 
  • High thermal and electrical conductivity 
  • Low sintering pressure for high yield manufacturing
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ALPHA Argomax 5022 Jar

Proven reliability in EV and rail traction applications

ALPHA Argomax 5022 Paste is specifically designed for low pressure sintering die attachment on dried paste applied on copper finish DBC substrates. It is formulated using Alpha’s proprietary engineered silver particles for improved attachment reliability with regular DBC without a gold or silver finish.

 

 

Related Products

Product Type Product Name Compatible Surface Finish Product Application Method End Application
Sinter Paste ALPHA Argomax 5040 Paste Cu Print, Dot Dispense Die Attach, Die Top Attach
Engineered Sinter Product ALPHA Argomax 6100 Laminated Clip Ag, Au, Cu Pick & Place Die Top Attach
Engineered Sinter Product ALPHA Argomax 6500 Bond Pad Ag, Au, Cu Pick & Place Die Top Attach
Engineered Sinter Product ALPHA Argomax 9500 Preform Cu Pick & Place Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

 

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