Product Overview

ALPHA Argomax 8020 Film is specifically designed for die and spacer lamination on silver surfaces using existing pick and place equipment.

ALPHA Argomax film provides a ready-to-laminate solution eliminating printing, dispensing and drying process steps. 

 

 

 

 

Product Features

  • Die-Transfer-Film (DTF) process
  • Designed for Ag/Au surfaces
  • Customized for fast and easy die and spacer lamination 
  • Pure silver bond line for high performance and reliability 
  • High thermal and electrical conductivity 
  • Low sintering pressure for high yield manufacturing 
  • Die attach temperatures suitable for semiconductor manufacturing 
     
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 Documentation icon - Brochure

ALPHA Argomax Power Electronics Brochure English

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 Documentation icon - Brochure

ALPHA Argomax 功率电子 宣传册 简体中文

Proven reliability for SiC die attach for EV Traction

ALPHA Argomax 8020 Film is specifically developed for die attachment using low pressure sintering process designed for high volume manufacturing.  It is formulated using highly engineered silver particles. 

This innovative film produces high thermal and electrical conductivity silver bonds between the various components that make up your device.

This film features good adhesion and with a consistent bond line thickness. 

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Related Products

Product Type Product Name Compatible Surface Finish Product Application Method End Application
Sinter Film ALPHA Argomax 8021 Film Ag, Au with special surface requirements Die Transfer Film Die Attach, Die Top Attach, Spacer Attach
Sinter Paste ALPHA Argomax 2010C Paste Ag, Au Print Die Attach, Die Top Attach
Sinter Paste ALPHA Argomax 2040 Paste Ag, Au Print, Dot Dispense Die Attach, Die Top Attach
Engineered Sinter Product ALPHA Argomax 6500 Bond Pad Ag, Au, Cu Print, Dot Dispense Die Top Attach
Engineered Sinter Product ALPHA Argomax 9200 Preform Ag, Au Print, Dot Dispense Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

 

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