ALPHA Argomax 8020 Film is specifically designed for die and spacer lamination on silver surfaces using existing pick and place equipment.
ALPHA Argomax film provides a ready-to-laminate solution eliminating printing, dispensing and drying process steps.
- Die-Transfer-Film (DTF) process
- Designed for Ag/Au surfaces
- Customized for fast and easy die and spacer lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
Proven reliability for SiC die attach for EV Traction
ALPHA Argomax 8020 Film is specifically developed for die attachment using low pressure sintering process designed for high volume manufacturing. It is formulated using highly engineered silver particles.
This innovative film produces high thermal and electrical conductivity silver bonds between the various components that make up your device.
This film features good adhesion and with a consistent bond line thickness.
|Product Type||Product Name||Compatible Surface Finish||Product Application Method||End Application|
|Sinter Film||ALPHA Argomax 8021 Film||Ag, Au with special surface requirements||Die Transfer Film||Die Attach, Die Top Attach, Spacer Attach|
|Sinter Paste||ALPHA Argomax 2010C Paste||Ag, Au||Die Attach, Die Top Attach|
|Sinter Paste||ALPHA Argomax 2040 Paste||Ag, Au||Print, Dot Dispense||Die Attach, Die Top Attach|
|Engineered Sinter Product||ALPHA Argomax 6500 Bond Pad||Ag, Au, Cu||Print, Dot Dispense||Die Top Attach|
|Engineered Sinter Product||ALPHA Argomax 9200 Preform||Ag, Au||Print, Dot Dispense||Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach|