Solutions Overview

Temporary bonding adhesives also need to handle subsequent processing such as plasma cleaning or etching as well as high temperatures or chemical exposures. Finally temporary adhesives need to be removed quickly and cleanly by heat or solvent exposure while not damaging critical or sensitive components in the process.

Wafer thinning and PECVD (plasma enhanced chemical vapor deposition) in vacuum chambers are the two critical steps for thin-wafer handling and often require temporary bonding adhesives or films.

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